DS Smith, provider of sustainable packaging solutions, pilots digital 3D dimensioning to transform logistic operations

DS Smith, a leader in sustainable packaging solutions, has recently piloted a digital 3D dimensioning solution to transform their logistic operations. The aim was to replace an end-of-line monitoring solution with a more automated, real-time measurement system that offered greater precision. Through the use of SICK’s Sensor Intelligence, DS Smith was able to achieve just that.

This pilot project is a great example of how cutting-edge technology can be adopted to enhance traditional manufacturing and logistics processes, offering benefits such as increased efficiency, reduced waste, and lower labor costs. As a worldwide provider of sustainable packaging and recycling services, DS Smith is leading the way in promoting a greener economy for the future.

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